Следене
Urmita Sikder
Urmita Sikder
Postdoctoral Scholar, Department of EECS, University of California, Berkeley
Потвърден имейл адрес: berkeley.edu
Заглавие
Позовавания
Позовавания
Година
Bouc–Wen hysteresis model identification using modified firefly algorithm
MA Zaman, U Sikder
Journal of Magnetism and Magnetic Materials 395, 229-233, 2015
592015
Optimization of multilayer antireflection coating for photovoltaic applications
U Sikder, MA Zaman
Optics & Laser Technology 79, 88-94, 2016
472016
Bangla license plate reader for metropolitan cities of Bangladesh using template matching
RA Baten, Z Omair, U Sikder
8th International Conference on Electrical and Computer Engineering, 776-779, 2014
292014
Back-end-of-line nano-electro-mechanical switches for reconfigurable interconnects
U Sikder, G Usai, TT Yen, K Horace-Herron, L Hutin, TJK Liu
IEEE Electron Device Letters 41 (4), 625-628, 2020
222020
Demonstration of 50-mV digital integrated circuits with microelectromechanical relays
ZA Ye, S Almeida, M Rusch, A Perlas, W Zhang, U Sikder, J Jeon, ...
2018 IEEE International Electron Devices Meeting (IEDM), 4.1. 1-4.1. 4, 2018
172018
There's plenty of room at the top
TJK Liu, U Sikder, K Kato, V Stojanovic
2017 IEEE 30th International Conference on Micro Electro Mechanical Systems …, 2017
162017
Toward monolithically integrated hybrid CMOS-NEM circuits
U Sikder, K Horace-Herron, TT Yen, G Usai, L Hutin, V Stojanović, TJK Liu
IEEE Transactions on Electron Devices 68 (12), 6430-6436, 2021
102021
Vertical NV-NEM switches in CMOS back-end-of-line: First experimental demonstration and array programming scheme
U Sikder, LP Tatum, TT Yen, TJK Liu
2020 IEEE International Electron Devices Meeting (IEDM), 21.2. 1-21.2. 4, 2020
102020
Optimization of idealized quantum dot intermediate band solar cells considering spatial variation of generation rates
U Sikder, A Haque
IEEE Access 1, 363-370, 2013
92013
Design optimization for NEM relays implemented in BEOL layers
U Sikder, TJK Liu
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference …, 2017
82017
Study of MEM relay contact design and body-bias effects on on-state resistance stability
B Osoba, SF Almeida, U Sikder, ZA Ye, X Hu, TK Esatu, TJK Liu
Journal of Microelectromechanical Systems 29 (6), 1531-1536, 2020
72020
Design technology co-optimization for back-end-of-line nonvolatile NEM switch arrays
LP Tatum, U Sikder, TJK Liu
IEEE Transactions on Electron Devices 68 (4), 1471-1477, 2021
52021
Design optimization study of reconfigurable interconnects
U Sikder, G Usai, L Hutin, TJK Liu
2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM …, 2018
52018
Non-Volatile Nano-Electro-Mechanical Switches and Hybrid Circuits in a 16 nm CMOS Back-End-of-Line Process
U Sikder, R Naous, V Stojanović, TJK Liu
IEEE Electron Device Letters 44 (1), 136-139, 2022
42022
Demonstration of Low EOT Gate Stack and Record Transconductance on nm nFETs Using 1.8 nm Ferroic HfO2-ZrO2 Superlattice
W Li, LC Wang, SS Cheema, N Shanker, JH Park, YH Liao, SL Hsu, ...
2021 IEEE International Electron Devices Meeting (IEDM), 13.6. 1-13.6. 4, 2021
42021
Balancing pull-in and adhesion stability margins in non-volatile NEM switches
G Usai, L Hutin, U Sikder, JL Muñoz-Gamarra, T Ernst, TJK Liu, M Vinet
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference …, 2017
42017
Effects of doping of intermediate band region on intermediate band solar cell characteristics
U Sikder, RU Ferdous, A Haque
2012 7th International Conference on Electrical and Computer Engineering …, 2012
42012
Characterization of interface trap density of In-rich InGaAs nMOSFETs with ALD Al2O3 as gate dielectric
S Sharmin, U Sikder, QDM Khosru
2010 IEEE Nanotechnology Materials and Devices Conference, 352-355, 2010
42010
3D integrated CMOS-NEM systems: Enabling next-generation computing technology
U Sikder, TJK Liu
2021 IEEE International Meeting for Future Electron Devices, Kansai (IMFEDK …, 2021
32021
Body-biased multiple-gate micro-electro-mechanical relays
AY Zhixin, SF Almeida, U Sikder, X Hu, TK Esatu, K Le, J Jeon, TJK Liu
IEEE Electron Device Letters 42 (3), 402-405, 2021
22021
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