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Amitesh Saha
Amitesh Saha
Intel Corporation, University of Rhode Island
Verified email at my.uri.edu - Homepage
Title
Cited by
Cited by
Year
Oil Emulsification Using Surface-Tunable Carbon Black Particles
A Saha, A Nikova, P Venkataraman, VT John, A Bose
ACS applied materials & interfaces 5 (8), 3094-3100, 2013
1162013
New Insights into the transformation of calcium sulfate hemihydrate to gypsum using time-resolved cryogenic transmission electron microscopy
A Saha, J Lee, SM Pancera, MF Bräeu, A Kempter, A Tripathi, A Bose
Langmuir 28 (30), 11182-11187, 2012
1072012
High capacity, stable silicon/carbon anodes for lithium-ion batteries prepared using emulsion-templated directed assembly
Y Chen, M Nie, BL Lucht, A Saha, PR Guduru, A Bose
ACS applied materials & interfaces 6 (7), 4678-4683, 2014
372014
In Situ Assembly of Hydrophilic and Hydrophobic Nanoparticles at Oil–Water Interfaces as a Versatile Strategy To Form Stable Emulsions
A Saha, VT John, A Bose
ACS applied materials & interfaces 7 (38), 21010-21014, 2015
292015
Shear free and blotless cryo-TEM imaging: a new method for probing early evolution of nanostructures
J Lee, A Saha, SM Pancera, A Kempter, J Rieger, A Bose, A Tripathi
Langmuir 28 (9), 4043-4046, 2012
252012
Corrosion in Liquid Cooling Systems with Water-Based Coolant–Part 2: Corrosion Reliability Testing and Failure Model
CU Kim, G Ni, G Kini, JY Chang, A Saha, A Antoniswamy, I Klein, ...
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
72020
Corrosion in Liquid Cooling Systems with Water-Based Coolant–Part 1: Flow Loop Design for Reliability Tests
G Kini, CU Kim, H Madanipour, JY Chang, A Saha, A Antoniswamy, ...
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
62020
Impact of nearly water-insoluble additives on the properties of vesicular suspensions
A Saha, S Chaudhuri, MP Godfrin, M Mamak, B Reeder, T Hodgdon, ...
Industrial & Engineering Chemistry Research 56 (4), 899-906, 2017
62017
Integrated circuit packages with thermal interface materials with different material compositions
SAC Arguedas, A Saha, MA Cartas, K Hackenberg, ET Valles
US Patent App. 16/419,827, 2020
52020
Channeled lids for integrated circuit packages
M Dubey, A Saha, MA Cartas, P Li, BD Falola
US Patent 11,670,569, 2023
42023
Integrated circuit packages with solder thermal interface materials with embedded particles
A Saha, SAC Arguedas, MA Cartas, K Hackenberg, P Li
US Patent App. 16/423,700, 2020
32020
Thermal management solutions for integrated circuit packages
A Saha, JY Chang, BK Gebrehiwot
US Patent App. 16/273,633, 2020
32020
Thermal management solutions using self-healing polymeric thermal interface materials
A Saha, S Gong, S Kothari
US Patent 11,551,997, 2023
22023
Solder thermal interface material (stim) with dopant
SD Mahapatra, BD Falola, A Saha, P Li
US Patent App. 16/406,593, 2020
12020
Latex Ink Receptive Coating
A Saha
US Patent App. 16/336,186, 2019
12019
UNDERSTANDING BEHAVIOR OF PARTICLE STABILIZED EMULSIONS AND TRANSFORMATIONS IN COLLOIDAL SYSTEMS
A Saha
12015
Oil emulsification using responsive carbon black particles
A Saha, A Nikova, P Venkataraman, V John, A Bose, PAH Reduces
papers of the american chemical society, 1155, 2012
12012
Lids for integrated circuit packages with solder thermal interface materials
BD Falola, SD Mahapatra, SAC Arguedas, P Li, A Saha
US Patent 11,817,369, 2023
2023
Knowledge Based Qualification for Thermal Interface Material Reliability
E Armagan, A Saha, KC Liu, B Gebrehiwot, M Cartas, A Das, T Rawlings, ...
2023 IEEE International Reliability Physics Symposium (IRPS), 1-7, 2023
2023
Facile synthesis, characterization and catalytic activity of nanoporous supports loaded with monometallic and bimetallic nanoparticles
A Saha, VT John, A Bose
Colloids and Surfaces A: Physicochemical and Engineering Aspects 491, 57-61, 2016
2016
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Articles 1–20