A digital library for a flexible low-voltage organic thin-film transistor technology M Elsobky, M Elattar, G Alavi, F Letzkus, H Richter, U Zschieschang, ... Organic Electronics 50, 491-498, 2017 | 44 | 2017 |
Chip-mounted dielectric resonator antenna with alignment and testing features DL Cuenca, J Hesselbarth, G Alavi 2016 46th European Microwave Conference (EuMC), 723-726, 2016 | 25 | 2016 |
Adaptive layout technique for microhybrid integration of chip-film patch G Alavi, H Sailer, B Albrecht, C Harendt, JN Burghartz IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (5 …, 2018 | 23 | 2018 |
Hybrid systems-in-foil—combining the merits of thin chips and of large-area electronics JN Burghartz, G Alavi, B Albrecht, T Deuble, M Elsobky, S Ferwana, ... IEEE Journal of the Electron Devices Society 7, 776-783, 2019 | 21 | 2019 |
Program FFlexCom—High frequency flexible bendable electronics for wireless communication systems T Meister, F Ellinger, JW Bartha, M Berroth, J Burghartz, M Claus, L Frey, ... 2017 IEEE international conference on microwaves, antennas, communications …, 2017 | 17 | 2017 |
Multi-chip patch in low stress polymer foils based on an adaptive layout for flexible sensor systems B Albrecht, G Alavi, M Elsobky, S Ferwana, U Passlack, C Harendt, ... 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-5, 2018 | 15 | 2018 |
On-chip mm-wave spherical dielectric resonator bandpass filter DL Cuenca, G Alavi, J Hesselbarth 2017 IEEE MTT-S International Microwave Symposium (IMS), 1460-1463, 2017 | 13 | 2017 |
Compensation of stress-induced warpage for polymer embedding of ultra-thin chips G Alavi, MU Hassan, C Harendt, JN Burghartz Proc. ICT. OPEN, 42-45, 2015 | 12 | 2015 |
Optimized adaptive layout technique for hybrid systems in foil G Alavi, JN Burghartz, H Sailer, B Albrecht, C Harendt 2017 21st European Microelectronics and Packaging Conference (EMPC …, 2017 | 11 | 2017 |
Embedding and interconnecting of ultra-thin rf chip in combination with flexible wireless hub in polymer foil G Alavi, M Rasteh, M Grözing, M Berroth, J Hesselbarth, JN Burghartz 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-5, 2018 | 9 | 2018 |
Low-loss mm-wave transition from on-chip microstrip to rectangular waveguide DL Cuenca, J Hesselbarth, G Alavi 2017 12th European Microwave Integrated Circuits Conference (EuMIC), 325-328, 2017 | 9 | 2017 |
Toward a flexible and adaptive wireless hub by embedding power amplifier thinned silicon chip and antenna in a polymer foil G Alavi, S Özbek, M Rasteh, M Grözing, M Berroth, J Hesselbarth, ... International Journal of Microwave and Wireless Technologies 11 (9), 864-871, 2019 | 7 | 2019 |
Ultra-thin sensor systems integrating silicon chips with on-foil passive and active components M Elsobky, G Alavi, B Albrecht, T Deuble, C Harendt, H Richter, Z Yu, ... Proceedings 2 (13), 748, 2018 | 7 | 2018 |
3-Path SiGe BiCMOS power amplifier on thinned substrate for IoT applications S Özbek, G Alavi, J Digel, M Grözing, JN Burghartz, M Berroth Integration 63, 291-298, 2018 | 7 | 2018 |
3-Path 5–6 GHz 0.25 μm SiGe BiCMOS power amplifier on thin substrate S Özbek, J Digel, M Grözing, M Berroth, G Alavi, JN Burghartz 2017 13th Conference on Ph. D. Research in Microelectronics and Electronics …, 2017 | 7 | 2017 |
Micro-hybrid system in polymer foil based on adaptive layout G Alavi, H Sailer, H Richter, B Albrecht, M Alshahed, C Harendt, ... 2016 6th Electronic System-Integration Technology Conference (ESTC), 1-5, 2016 | 7 | 2016 |
Three-path SiGe BiCMOS LNA on thinned silicon substrate for IoT applications S Özbek, M Grözing, G Alavi, JN Burghartz, M Berroth 2018 48th European Microwave Conference (EuMC), 1241-1244, 2018 | 6 | 2018 |
Hybrid system-in-foil integration and interconnection technology based on adaptive layout technique G Alavi | 5 | 2019 |
Hybrid Systems-in-Foil-Combining Thin Chips with Large-Area Electronics JN Burghartz, G Alavi, B Albrecht, T Deuble, M Elsobky, S Ferwana, ... 2018 International Flexible Electronics Technology Conference (IFETC), 1-6, 2018 | 4 | 2018 |
Embedding ultra-thin implantable biosensor system in polymers foil G Alavi, M Nawito, R Saleh, MU Hassan, C Harendt, H Richter, A Stett, ... Proc. Südwest ClusterKonferenz, 2016 | 3 | 2016 |