Mark D Poliks
Mark D Poliks
SUNY Distinguished Professor, State University of New York at Binghamton
Потвърден имейл адрес: binghamton.edu
Flexible hybrid electronics: Direct interfacing of soft and hard electronics for wearable health monitoring
Y Khan, M Garg, Q Gui, M Schadt, A Gaikwad, D Han, NAD Yamamoto, ...
Advanced Functional Materials 26 (47), 8764-8775, 2016
Study of the interlayer expansion mechanism and thermal–mechanical properties of surface-initiated epoxy nanocomposites
JS Chen, MD Poliks, CK Ober, Y Zhang, U Wiesner, E Giannelis
Polymer 43 (18), 4895-4904, 2002
Reworkable epoxies: thermosets with thermally cleavable groups for controlled network breakdown
S Yang, JS Chen, H Körner, T Breiner, CK Ober, MD Poliks
Chemistry of materials 10 (6), 1475-1482, 1998
Multi-layered interconnect structure using liquid crystalline polymer dielectric
FD Egitto, DS Farquhar, VR Markovich, MD Poliks, DO Powell
US Patent 7,301,108, 2007
Tamper-responding encapsulated enclosure having flexible protective mesh structure
DS Farquhar, C Feger, V Markovich, KI Papathomas, MD Poliks, JM Shaw, ...
US Patent 6,929,900, 2005
Controlled degradation of epoxy networks: analysis of crosslink density and glass transition temperature changes in thermally reworkable thermosets
JS Chen, CK Ober, MD Poliks, Y Zhang, U Wiesner, C Cohen
Polymer 45 (6), 1939-1950, 2004
Characterization of thermally reworkable thermosets: materials for environmentally friendly processing and reuse
JS Chen, CK Ober, MD Poliks
Polymer 43 (1), 131-139, 2002
Conformation of microtubule-bound paclitaxel determined by fluorescence spectroscopy and REDOR NMR
Y Li, B Poliks, L Cegelski, M Poliks, Z Gryczynski, G Piszczek, PG Jagtap, ...
Biochemistry 39 (2), 281-291, 2000
Dielectric composition and solder interconnection structure for its use
K Papathomas, MD Poliks, DW Wang, FR Christie
US Patent 5,194,930, 1993
Computational fluid dynamics modeling and online monitoring of aerosol jet printing process
R Salary, JP Lombardi, M Samie Tootooni, R Donovan, PK Rao, ...
Journal of Manufacturing Science and Engineering 139 (2), 021015, 2017
High-resolution carbon-13 and nitrogen-15 NMR investigations of the mechanism of the curing reactions of cyanate-based polymer resins in solution and the solid state
CA Fyfe, J Niu, SJ Rettig, NE Burlinson
Macromolecules 25 (23), 6289-6301, 1992
Low CTE power and ground planes
RM Japp, MD Poliks
US Patent 6,329,603, 2001
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
BE Curcio, DS Farquhar, KI Papathomas, MD Poliks
US Patent 6,465,084, 2002
Flexible chemiresistor sensors: Thin film assemblies of nanoparticles on a polyethylene terephthalate substrate
L Wang, J Luo, J Yin, H Zhang, J Wu, X Shi, E Crew, Z Xu, Q Rendeng, ...
Journal of Materials Chemistry 20 (5), 907-915, 2010
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes
BE Curcio, PA Gruber, F Maurer, KI Papathomas, MD Poliks
US Patent 6,452,117, 2002
NMR investigation of chain deformation in sheared polymer fluids
AI Nakatani, MD Poliks, ET Samulski
Macromolecules 23 (10), 2686-2692, 1990
Electronic package utilizing protective coating
RD Havens, RM Japp, JA Knight, MD Poliks, AM Quinn
US Patent 6,351,030, 2002
Online monitoring of functional electrical properties in aerosol jet printing additive manufacturing process using shape-from-shading image analysis
R Salary, JP Lombardi, PK Rao, MD Poliks
Journal of Manufacturing Science and Engineering 139 (10), 101010, 2017
Conductive metal micro-pillars for enhanced electrical interconnection
RN Das, KI Papathomas, MD Poliks, VR Markovich
US Patent App. 13/082,502, 2012
Heart monitor using flexible capacitive ECG electrodes
Y Gao, VV Soman, JP Lombardi, PP Rajbhandari, TP Dhakal, DG Wilson, ...
IEEE Transactions on Instrumentation and Measurement 69 (7), 4314-4323, 2019
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