Seungbae Park

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Huayan WangState University of New York at BinghamtonVerified email at binghamton.edu
Ke PanBinghamton UniversityVerified email at binghamton.edu
Jiefeng XuBinghamton UniversityVerified email at binghamton.edu
Yuling NiuBinghamton UniversityVerified email at binghamton.edu
Jing WangState University of New York at BinghamtonVerified email at binghamton.edu
Da YuSUNY-BinghamtonVerified email at binghamton.edu
Junbo YangBinghamton UniversityVerified email at binghamton.edu
Yangyang LaiBinghamton UniversityVerified email at binghamton.edu
Chongyang CaiBinghamton UniversityVerified email at binghamton.edu
Jonghwan HaBinghamton UniversityVerified email at binghamton.edu
Shuai ShaoAdvanced Micro Devices, Inc.Verified email at amd.com
Pengcheng YinBinghamton UniversityVerified email at binghamton.edu
VanLai PhamBinghamton UniversityVerified email at binghamton.edu
Dapeng LiuMicrosoft CorporationVerified email at microsoft.com
Ruiyang Liu, Ph.DSUNY BinghamtonVerified email at binghamton.edu
Yeonsung KimPackaging engineer at QualcommVerified email at qti.qualcomm.com
James M PitarresiAssistant Provost, Binghamton UniversityVerified email at binghamton.edu
Satish ChaparalaProduct Quality and Reliability Engineer, Applied MaterialsVerified email at AMAT.com
Daehan WonBinghamton University, State University of New YorkVerified email at binghamton.edu
Ah-Young ParkPhD, Mechanical Engineering, State University of New York at BinghamtonVerified email at binghamton.edu

Seungbae Park

Professor of Mechanical Engineering, Binghamton University

Verified email at binghamton.edu - Homepage

Solid Mechanics Electronic Packaging


Title Sort by citations Sort by year Sort by title	Cited by Cited by	Year
Fracture criteria for piezoelectric ceramics S Park, CT Sun Journal of the american ceramic society 78 (6), 1475-1480, 1995	729	1995
Effect of electric field on fracture of piezoelectric ceramics SB Park, CT Sun International Journal of Fracture 70, 203-216, 1993	462	1993
High-cycle fatigue life prediction for Pb-free BGA under random vibration loading D Yu, A Al-Yafawi, TT Nguyen, S Park, S Chung Microelectronics Reliability 51 (3), 649-656, 2011	177	2011
Design, fabrication, and experimental characterization of a flap valve IPMC micropump with a flexibly supported diaphragm TT Nguyen, NS Goo, VK Nguyen, Y Yoo, S Park Sensors and Actuators A: Physical 141 (2), 640-648, 2008	138	2008
Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading S Park, R Dhakal, L Lehman, E Cotts Acta materialia 55 (9), 3253-3260, 2007	129	2007
Accurate assessment of packaging stress effects on MEMS sensors by measurement and sensor–package interaction simulations X Zhang, S Park, MW Judy Journal of microelectromechanical systems 16 (3), 639-649, 2007	101	2007
Transient dynamic simulation and full-field test validation for a slim-PCB of mobile phone under drop/impact S Park, C Shah, J Kwak, C Jang, J Pitarresi, T Park, S Jang 2007 Proceedings 57th Electronic Components and Technology Conference, 914-923, 2007	100	2007
Three-dimensional shape measurement with a fast and accurate approach Z Wang, H Du, S Park, H Xie Applied optics 48 (6), 1052-1061, 2009	90	2009
Effects of temperature on mechanical properties of SU-8 photoresist material S Chung, S Park Journal of Mechanical Science and Technology 27, 2701-2707, 2013	82	2013
Characterizing the mechanical properties of actual SAC105, SAC305, and SAC405 solder joints by digital image correlation TT Nguyen, D Yu, SB Park Journal of Electronic Materials 40, 1409-1415, 2011	75	2011
Advanced thermal-moisture analogy scheme for anisothermal moisture diffusion problem C Jang, S Park, B Han, S Yoon	75	2008
Predictive model for optimized design parameters in flip-chip packages and assemblies S Park, HC Lee, B Sammakia, K Raghunathan IEEE Transactions on Components and Packaging Technologies 30 (2), 294-301, 2007	66	2007
Dynamic responses of PCB under product-level free drop impact D Yu, JB Kwak, S Park, J Lee Microelectronics Reliability 50 (7), 1028-1038, 2010	61	2010
Three-dimensional and 2.5 dimensional interconnection technology: State of the art D Liu, S Park Journal of Electronic Packaging 136 (1), 014001, 2014	58	2014
Warpage compensating heat spreader EA Johnson, S Park US Patent 6,288,900, 2001	58	2001
Effect of oxidation on indium solderability J Kim, H Schoeller, J Cho, S Park Journal of electronic materials 37, 483-489, 2008	51	2008
Effect of glue on reliability of flip chip BGA packages under thermal cycling TT Nguyen, D Lee, JB Kwak, S Park Microelectronics Reliability 50 (7), 1000-1006, 2010	49	2010
Moisture diffusion modeling–A critical review EH Wong, SB Park Microelectronics Reliability 65, 318-326, 2016	46	2016
Shorter field life in power cycling for organic packages SB Park, IZ Ahmed	46	2007
A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs C Cai, J Xu, H Wang, SB Park Microelectronics Reliability 119, 114065, 2021	44	2021

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