| Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound Y Kim, D Liu, H Lee, R Liu, D Sengupta, S Park Components, Packaging and Manufacturing Technology, IEEE Transactions on 5 …, 2015 | 38 | 2015 |
| Prediction of deformation during manufacturing processes of silicon interposer package with TSVs Y Kim, AY Park, CL Kao, M Su, B Black, S Park Microelectronics Reliability 65, 234-242, 2016 | 31 | 2016 |
| Optimal material properties of molding compounds for MEMS package Y Kim, H Lee, X Zhang, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014 | 23 | 2014 |
| Stress evolution in an encapsulated MEMS package due to viscoelasticity of packaging materials S Park, D Liu, Y Kim, H Lee, S Zhang 2012 IEEE 62nd Electronic Components and Technology Conference, 70-75, 2012 | 15 | 2012 |
| Moisture diffusion and hygroscopic swelling of adhesives in electronics packaging R Liu, H Wang, J Wang, H Lee, SB Park, X Xue, Y Kim, S Saiyed, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2203-2209, 2016 | 14 | 2016 |
| Stress relaxation test of molding compound for MEMS packaging Y Kim, H Lee, S Park, X Zhang 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 11 | 2012 |
| Prediction of thermal fatigue life on mBGA solder joint using Sn-3.5 Ag, Sn-3.5 Ag-0.7 Cu, Sn-3.5 Ag-3.0 In-0.5 Bi solder alloys YS Ki, HI Kim, JM Kim, YE Shin JWJ 21, 92-98, 2003 | 10 | 2003 |
| Wafer level package solder joint reliability study for portable electronic devices SY Jang, TS Park, YS Kim, JW Jeong, JJ Ban, DK Kang Proceedings Electronic Components and Technology, 2005. ECTC'05., 660-664, 2005 | 8 | 2005 |
| Optimization of underfill material for better reliability and thermal behavior of 3D packages with TSVs Y Kim, SB Park 2013 IEEE 63rd Electronic Components and Technology Conference, 2310-2318, 2013 | 6 | 2013 |
| Comparative study of analytical models to predict warpage in microelectronics packages C Singh, Y Kim, S Park ASME International Mechanical Engineering Congress and Exposition 46590 …, 2014 | 5 | 2014 |
| Selection of proper fatigue model for flip chip package reliability YE Shin, YS Kim, HI Kim, JM Kim, KH Chang, DF Farson Materials Science Forum 502, 393-398, 2005 | 4 | 2005 |
| The Thermal Fatigue Analysis and Life Evaluation of Solder Joint for Flip Chip Package using Darveaux Model YE Shin, YS Kim, JM Kim, MG Choi Journal of KWJS 22 (6), 36-42, 2005 | 4 | 2005 |
| Packaged devices with integrated antennas YJ Kook, Y Kim, D Sengupta US Patent 10,593,634, 2020 | 2 | 2020 |
| Design Study to Prevent Mold Delamination for Overmolded Lead Frame Package Y Kim, C Raleigh, S Saiyed 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 2 | 2019 |
| Effect of High Tg Mold Compound on MEMS Sensor Package Performance Y Kim, D Sengupta, B Dufort, D Liu, M Zylinski 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 666-672, 2016 | 1 | 2016 |
| Stress and deformation minimization of MEMS sensor package and TSV interposer package Y Kim State University of New York at Binghamton, 2014 | 1 | 2014 |
| Low stress integrated device package Y Kim, S Saiyed, TM Goida US Patent 11,702,335, 2023 | | 2023 |
