| Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics YJ Chen, CK Chung, CR Yang, CR Kao Microelectronics Reliability 53 (1), 47-52, 2013 | 59 | 2013 |
| Direct evidence for a Cu-enriched region at the boundary between Cu6Sn5 and Cu3Sn during Cu/Sn reaction CK Chung, JG Duh, CR Kao Scripta Materialia 63 (2), 258-260, 2010 | 58 | 2010 |
| Solder joint reliability of Sn-Ag-Cu BGA components attached with eutectic Pb-Sn solder paste F Hua, R Aspandiar, T Rothman, C Anderson, G Clemons, M Klier, ... Journal of surface mount technology 16 (1), 34-42, 2003 | 57* | 2003 |
| Organic-inorganic hybrid structure for integrated circuit packages P Huang, H Su, CK Chung, R Ong, J Wang, D Hsieh US Patent 9,754,849, 2017 | 40 | 2017 |
| Low temperature soldering Z Mei, F Hua, J Glazer, CK Chung Electronics Manufacturing Technology Symposium, 1997., Twenty-First IEEE …, 1997 | 37 | 1997 |
| Scalable chiplet package using fan-out embedded bridge J Lin, CK Chung, CF Lin, A Liao, YJ Lu, JS Chen, D Ng 2020 IEEE 70th electronic components and technology conference (ECTC), 14-18, 2020 | 35 | 2020 |
| The interactions of lead (Pb) in lead free solder (Sn/Ag/Cu) system CK Chung, R Aspandiar, KF Leong, CS Tay 52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002 | 35 | 2002 |
| Volume Shrinkage Induced by Interfacial Reaction in Micro-Ni/Sn/Ni Joints CC Li, CK Chung, WL Shin, CR Kao Metallurgical and Materials Transactions A 45 (5), 2343-2346, 2014 | 34 | 2014 |
| The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction WM Chen, TL Yang, CK Chung, CR Kao Scripta Materialia 65 (4), 331-334, 2011 | 34 | 2011 |
| The critical oxide thickness for Pb-free reflow soldering on Cu substrate CK Chung, YJ Chen, CC Li, CR Kao Thin Solid Films 520 (16), 5346–5352, 2012 | 33 | 2012 |
| Origin and Evolution of Voids in Electroless Ni during Soldering Reaction CK Chung, YJ Chen, WM Chen, CR Kao Acta Materialia 60 (11), 4586–4593, 2012 | 33 | 2012 |
| Analysis of warpage and stress behavior in a fine pitch multi-chip interconnection with ultrafine-line organic substrate (2.1 D) CY Huang, YH Hsu, YJ Lu, KH Yu, WS Tsai, CF Lin, CK Chung 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 631-637, 2018 | 22 | 2018 |
| Generational Changes of Flip Chip Interconnection Technology WS Tsai, CY Huang, KH Yu, CF Lin, CK Chung. International Microsystems, Packaging, Assembly, and Circuits Tech. Conf., 2017 | 22 | 2017 |
| Lidless and lidded flip chip packages for advanced applications G Refai-Ahmed, H Wang, S Ramalingam, N Karunakaran, K Pan, SB Park, ... 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 104-111, 2020 | 18 | 2020 |
| Assembly and reliability challenges for next generation high thermal TIM materials CA Pan, CT Yeh, WC Qiu, RZ Lin, LY Hung, KT Ng, CF Lin, CK Chung, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2033-2039, 2017 | 16 | 2017 |
| COPPER RING SOLDER MASK DEFINED BALL GRID ARRAY PAD CK Chung, KF Leong, TT Pang US Patent US7230339B2, 2007 | 15* | 2007 |
| Apparatus and methods for interconnecting components to via-in-pad interconnects CK Chung, SC Chan, KF Leong US Patent 6,828,512, 2004 | 15 | 2004 |
| Oxidation behavior of ENIG and ENEPIG surface finish CC Lee, HY Chuang, CK Chung, CR Kao 2010 5th International Microsystems Packaging Assembly and Circuits …, 2010 | 13 | 2010 |
| Electrical Performances of Fan-Out Embedded Bridge JW You, D Ho, J Li, MH Zhuang, D Lai, CK Chung, YP Wang 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021 | 12 | 2021 |
| Amorphous Pd layer as a highly effective oxidation barrier for surface finish of electronic terminals CC Li, WL Shih, CK Chung, CR Kao Corrosion Science 83, 419–422, 2014 | 12 | 2014 |
C R KaoProfessor of Materials Science & Engineering, National Taiwan UniversityVerified email at ntu.edu.tw
