| An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model Y Lai, K Pan, Y Cen, J Yang, C Cai, P Yin, S Park Soldering & Surface Mount Technology 34 (5), 266-276, 2022 | 24 | 2022 |
| Determination of Smarter Reflow Profile to Achieve Uniform Temperature throughout a Board Y Lai State University of New York at Binghamton. In PROQUESTMS Dissertations …, 2021 | 20 | 2021 |
| Determination of Smarter Reflow Profile to Achieve a Uniform Temperature Throughout a Board Y Lai, K Pan, J Xu, J Yang, S Park 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 20 | 2021 |
| Investigation of copper and glass interaction in through glass via (TGV) during thermal cycling K Pan, J Xu, Y Lai, S Park, C Okoro, D Joshi, S Pollard 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1660-1666, 2021 | 19 | 2021 |
| A comparison study of TIM degradation of phase change material and thermal grease J Yang, Y Lai, K Pan, J Xu, T Mikjaniec, S Cain, S Park 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1978-1983, 2021 | 18 | 2021 |
| Smarter temperature setup for reflow oven to minimize temperature variation among components Y Lai, K Pan, C Cai, P Yin, J Yang, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 16 | 2022 |
| In-situ temperature-dependent characterization of copper through glass via (TGV) K Pan, J Xu, Y Lai, S Park, C Okoro, D Joshi, S Pollard Microelectronics Reliability 129, 114487, 2022 | 12 | 2022 |
| Shape dependency of fatigue life in solder joints of chip resistors J Ha, C Cai, P Yin, Y Lai, K Pan, J Yang, S Park 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1489-1494, 2022 | 11 | 2022 |
| The optimal solution of reflow oven recipe based on physics-guided machine learning model Y Lai, K Pan, J Ha, C Cai, J Yang, P Yin, J Xu, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 10 | 2022 |
| A deep learning approach for reflow profile prediction Y Lai, J Kataoka, K Pan, J Ha, J Yang, KA Deo, J Xu, P Yin, C Cai, S Park 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2269-2274, 2022 | 10 | 2022 |
| Reflow recipe establishment based on CFD-Informed machine learning model Y Lai, JH Ha, KA Deo, J Yang, P Yin, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 9 | 2023 |
| Thermomechanical reliability of BGA packages with different underfill reinforcement methods Y Lai, C Cai, K Pan, J Yang, J Ha, P Yin, K Deo, S Park International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 7 | 2022 |
| A study on parameters that impact the thermal fatigue life of BGA solder joints K Arun Deo, RN Kono, C Cai, J Yang, Y Lai, S Park International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 7 | 2022 |
| Optimal thermo-mechanical reliability design of 2.5 D lidless package J Yang, C Cai, P Yin, K Pan, Y Lai, J Wang, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 7 | 2022 |
| A comparative study of the thermomechanical reliability of fully-filled and conformal through-glass via K Pan, C Okoro, Y Lai, D Joshi, S Park, S Pollard 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1211-1217, 2022 | 7 | 2022 |
| Parametric study of the geometry design of through-silicon via in silicon interposer K Pan, Y Lai, J Xu, P Yin, J Ha, C Cai, J Yang, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 6 | 2022 |
| Characterization of constitutive equation of Sn-Bi by studying creep behavior of flip chip solder joints C Cai, K Pan, K Deo, Y Lai, J Yang, J Wang, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 4 | 2022 |
| Evaluation of electromigration coupling different physics fields in numerical simulation C Cai, J Xu, Y Lai, J Yang, H Wang, S Ramalingam, G Refai-Ahmed, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 3 | 2022 |
| Reflow profiling with the aid of machine learning models Y Lai, S Park Soldering & Surface Mount Technology, 2023 | 2 | 2023 |
| Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life JH Ha, Y Lai, J Yang, P Yin, S Park Journal of Electronic Packaging, 1-62, 2024 | 1 | 2024 |
Seungbae ParkProfessor of Mechanical Engineering, Binghamton UniversityVerified email at binghamton.edu
