| An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model Y Lai, K Pan, Y Cen, J Yang, C Cai, P Yin, S Park Soldering & Surface Mount Technology 34 (5), 266-276, 2022 | 24 | 2022 |
| Determination of smarter reflow profile to achieve a uniform temperature throughout a board Y Lai, K Pan, J Xu, J Yang, S Park 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 20 | 2021 |
| Comparative analysis of package warpage using confocal method and digital image correlation C Cai, K Pan, J Yang, S Park 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 19 | 2020 |
| A comparison study of TIM degradation of phase change material and thermal grease J Yang, Y Lai, K Pan, J Xu, T Mikjaniec, S Cain, S Park 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1978-1983, 2021 | 18 | 2021 |
| Smarter temperature setup for reflow oven to minimize temperature variation among components Y Lai, K Pan, C Cai, P Yin, J Yang, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 16 | 2022 |
| Shape dependency of fatigue life in solder joints of chip resistors J Ha, C Cai, P Yin, Y Lai, K Pan, J Yang, S Park 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1489-1494, 2022 | 11 | 2022 |
| The optimal solution of reflow oven recipe based on physics-guided machine learning model Y Lai, K Pan, J Ha, C Cai, J Yang, P Yin, J Xu, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 10 | 2022 |
| A deep learning approach for reflow profile prediction Y Lai, J Kataoka, K Pan, J Ha, J Yang, KA Deo, J Xu, P Yin, C Cai, S Park 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2269-2274, 2022 | 10 | 2022 |
| Reflow recipe establishment based on CFD-Informed machine learning model Y Lai, JH Ha, KA Deo, J Yang, P Yin, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 9 | 2023 |
| Identification of polymer materials in electronic packages including counterfeit prevention J Yang, J Xu, S Park 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2317-2324, 2020 | 9 | 2020 |
| Thermomechanical reliability of BGA packages with different underfill reinforcement methods Y Lai, C Cai, K Pan, J Yang, J Ha, P Yin, K Deo, S Park International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 7 | 2022 |
| A study on parameters that impact the thermal fatigue life of BGA solder joints K Arun Deo, RN Kono, C Cai, J Yang, Y Lai, S Park International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 7 | 2022 |
| Optimal thermo-mechanical reliability design of 2.5 D lidless package J Yang, C Cai, P Yin, K Pan, Y Lai, J Wang, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 7 | 2022 |
| Parametric study of the geometry design of through-silicon via in silicon interposer K Pan, Y Lai, J Xu, P Yin, J Ha, C Cai, J Yang, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 6 | 2022 |
| Characterization of constitutive equation of Sn-Bi by studying creep behavior of flip chip solder joints C Cai, K Pan, K Deo, Y Lai, J Yang, J Wang, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 4 | 2022 |
| Evaluation of electromigration coupling different physics fields in numerical simulation C Cai, J Xu, Y Lai, J Yang, H Wang, S Ramalingam, G Refai-Ahmed, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 3 | 2022 |
| Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life JH Ha, Y Lai, J Yang, P Yin, S Park Journal of Electronic Packaging, 1-62, 2024 | 1 | 2024 |
| Enhanced solder fatigue life of chip resistor by optimizing solder shape J Ha, Y Lai, J Yang, P Yin, S Park Microelectronics Reliability 145, 114994, 2023 | 1 | 2023 |
| A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage C Cai, H Wang, J Yang, P Yin, SB Park Journal of Electronic Packaging 146 (2), 2024 | | 2024 |
| High-Temperature Constitutive Behavior of Electroplated Copper TGV through Numerical Simulation K Pan, J Yang, Y Lai, S Park, C Okoro, D Joshi, S Pollard IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | | 2023 |
Seungbae ParkProfessor of Mechanical Engineering, Binghamton UniversityVerified email at binghamton.edu
