| Prediction of deformation during manufacturing processes of silicon interposer package with TSVs Y Kim, AY Park, CL Kao, M Su, B Black, S Park Microelectronics Reliability 65, 234-242, 2016 | 31 | 2016 |
| TSV and Cu-Cu direct bond wafer and package-level reliability K Hummler, B Sapp, JR Lloyd, S Kruger, S Olson, SB Park, B Murray, ... Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, 41-48, 2013 | 19 | 2013 |
| Modification of pinch instability theory for analysis of spray mode in GMAW AY Park, SR Kim, MA Hammad, CD Yoo Journal of Physics D: Applied Physics 42 (22), 225503, 2009 | 12 | 2009 |
| Thermo-mechanical simulations of a copper-to-copper direct bonded 3D TSV chip package interaction test vehicle AY Park, D Ferrone, S Cain, DY Jung, BT Murray, S Park, K Hummler 2013 IEEE 63rd Electronic Components and Technology Conference, 2228-2234, 2013 | 9 | 2013 |
| Evaluation of crack propagation at the interconnection interface induced by warpage of fan-out wafer-level-package AY Park, JH Lee, JY Song, SM Kim, S Han 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 99-102, 2019 | 5 | 2019 |
| A Fracture mechanics based parametric study of the copper-to-copper direct thermo-compression bonded interface using finite element method AY Park, S Chaparala, S Park International Electronic Packaging Technical Conference and Exhibition 55751 …, 2013 | 4 | 2013 |
| Risk assessment of the crack propagation and delamination of the Cu-to-Cu direct bonded (CuDB) interface AY Park, SC Chaparala, SB Park Microelectronics Reliability 66, 113-121, 2016 | 3 | 2016 |
| A fracture mechanics based parametric study with dimensional variables of the Cu-Cu direct thermo-Compression bonded interface using FEA AY Park, SC Chaparala, SB Park 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1926-1931, 2015 | 3 | 2015 |
| Development of inclined conductive bump for flip-chip interconnection AY Park, S Park, CD Yoo IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (2 …, 2014 | 3 | 2014 |
| Low height wire bond looping technology using wedge bonding for the MMIC package AY Park, JH Lee, S Kim, S Kang, S Han, SI Kim, JY Song 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC …, 2022 | 1 | 2022 |
| An efficient edge traces technique for 3D interconnection of stack chip SR Kim, AY Park, CD Yoo, JH Lee, JY Song, SS Lee 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1878-1882, 2011 | 1 | 2011 |
| Development of inclined conductive bump (ICB) for flip-chip interconnection AY Park, SR Kim, CD Yoo, TS Kim 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 880-885, 2011 | 1 | 2011 |
| Optimization of process parameters in micro-scale pneumatic aerosol jet printing for high-yield precise electrodes H Jeong, JH Lee, S Kim, S Han, H Moon, JY Song, AY Park Scientific Reports 13 (1), 21297, 2023 | | 2023 |
| Machine Learning‐Based Solution for Thermomechanical Analysis of MMIC Packaging S Kang, JH Lee, SM Kim, J Lim, AY Park, S Han, JY Song, SI Kim Advanced Materials Technologies 8 (5), 2201479, 2023 | | 2023 |
| Hybrid Solder with silver hierarchical structure and particle for Synergistic effect in shear strength of die attach behaviour H Jeong, JH Lee, SM Kim, AY Park, JY Song 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 509-512, 2022 | | 2022 |
| Thermo-mechanical problems and their solution in a 3D micro-electronics package using Cu-to-Cu direct bonding AY Park State University of New York at Binghamton, 2017 | | 2017 |
| Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding AY Park, SB Park International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015 | | 2015 |
| Development of Inclined Conductive Bump for Electronic Packaging AY Park, SR Kim, CD Yoo, T Kim Proceedings of the Korean Society of Precision Engineering Conference, 731-732, 2011 | | 2011 |
| Design of Spool and Bar Horns for Ultrasonic Bonding SR Kim, JH Lee, AY Park, CD Yoo Elsevier Science Bv, 2010 | | 2010 |
| Analysis of Spray Mode Using Modified Pinch Instability Theory AY Park, MA Hammad, SR Kim, CD Yoo Journal of Welding and Joining 27 (5), 88-93, 2009 | | 2009 |
