Ultrasensitive mechanical crack-based sensor inspired by the spider sensory system D Kang, PV Pikhitsa, YW Choi, C Lee, SS Shin, L Piao, B Park, KY Suh, ... Nature 516 (7530), 222-226, 2014 | 1359 | 2014 |
A soft, wearable microfluidic device for the capture, storage, and colorimetric sensing of sweat A Koh, D Kang, Y Xue, S Lee, RM Pielak, J Kim, T Hwang, S Min, A Banks, ... Science translational medicine 8 (366), 366ra165-366ra165, 2016 | 1140 | 2016 |
Dramatically Enhanced Mechanosensitivity and Signal-to-Noise Ratio of Nanoscale Crack-Based Sensors: Effect of Crack Depth. B Park, J Kim, D Kang, C Jeong, KS Kim, JU Kim, PJ Yoo, T Kim Advanced Materials (Deerfield Beach, Fla.) 28 (37), 8130-8137, 2016 | 309 | 2016 |
Battery-free, wireless sensors for full-body pressure and temperature mapping S Han, J Kim, SM Won, Y Ma, D Kang, Z Xie, KT Lee, HU Chung, A Banks, ... Science translational medicine 10 (435), eaan4950, 2018 | 307 | 2018 |
Thin, soft, skin‐mounted microfluidic networks with capillary bursting valves for chrono‐sampling of sweat J Choi, D Kang, S Han, SB Kim, JA Rogers Advanced healthcare materials 6 (5), 1601355, 2017 | 279 | 2017 |
Relation between blood pressure and pulse wave velocity for human arteries Y Ma, J Choi, A Hourlier-Fargette, Y Xue, HU Chung, JY Lee, X Wang, ... Proceedings of the National Academy of Sciences 115 (44), 11144-11149, 2018 | 254 | 2018 |
Ultra-flexible perovskite solar cells with crumpling durability: Toward a wearable power source G Lee, M Kim, YW Choi, N Ahn, J Jang, J Yoon, SM Kim, JG Lee, D Kang, ... Energy & Environmental Science 12 (10), 3182-3191, 2019 | 154 | 2019 |
Soft core/shell packages for stretchable electronics CH Lee, Y Ma, KI Jang, A Banks, T Pan, X Feng, JS Kim, D Kang, MS Raj, ... Advanced Functional Materials 25 (24), 3698-3704, 2015 | 145 | 2015 |
Soft, skin-mounted microfluidic systems for measuring secretory fluidic pressures generated at the surface of the skin by eccrine sweat glands J Choi, Y Xue, W Xia, TR Ray, JT Reeder, AJ Bandodkar, D Kang, S Xu, ... Lab on a Chip 17 (15), 2572-2580, 2017 | 144 | 2017 |
Bioinspired reversible interlocker using regularly arrayed high aspect-ratio polymer fibers. C Pang, TI Kim, WG Bae, D Kang, SM Kim, KY Suh Advanced Materials (Deerfield Beach, Fla.) 24 (4), 475-479, 2011 | 130 | 2011 |
Ultra-sensitive pressure sensor based on guided straight mechanical cracks YW Choi, D Kang, PV Pikhitsa, T Lee, SM Kim, G Lee, D Tahk, M Choi Scientific reports 7 (1), 40116, 2017 | 112 | 2017 |
Shape-controllable microlens arrays via direct transfer of photocurable polymer droplets. D Kang, C Pang, SM Kim, HS Cho, HS Um, YW Choi, KY Suh Advanced Materials (Deerfield Beach, Fla.) 24 (13), 1709-1715, 2012 | 103 | 2012 |
Transparent ITO mechanical crack-based pressure and strain sensor T Lee, YW Choi, G Lee, PV Pikhitsa, D Kang, SM Kim, M Choi Journal of Materials Chemistry C 4 (42), 9947-9953, 2016 | 98 | 2016 |
Arrays of Lucius microprisms for directional allocation of light and autostereoscopic three-dimensional displays H Yoon, SG Oh, DS Kang, JM Park, SJ Choi, KY Suh, K Char, HH Lee Nature communications 2 (1), 455, 2011 | 73 | 2011 |
Crack-based strain sensor with diverse metal films by inserting an inter-layer T Lee, YW Choi, G Lee, SM Kim, D Kang, M Choi RSC advances 7 (55), 34810-34815, 2017 | 63 | 2017 |
A semi-permanent and durable nanoscale-crack-based sensor by on-demand healing B Park, S Lee, H Choi, JU Kim, H Hong, C Jeong, D Kang, T Kim Nanoscale 10 (9), 4354-4360, 2018 | 58 | 2018 |
Polyimide encapsulation of spider-inspired crack-based sensors for durability improvement T Kim, T Lee, G Lee, YW Choi, SM Kim, D Kang, M Choi Applied Sciences 8 (3), 367, 2018 | 50 | 2018 |
Vital signal sensing and manipulation of a microscale organ with a multifunctional soft gripper Y Roh, M Kim, SM Won, D Lim, I Hong, S Lee, T Kim, C Kim, D Lee, S Im, ... Science Robotics 6 (59), eabi6774, 2021 | 47 | 2021 |
Strain‐visualization with ultrasensitive nanoscale crack‐based sensor assembled with hierarchical thermochromic membrane B Park, JU Kim, J Kim, D Tahk, C Jeong, J Ok, JH Shin, D Kang, T Kim Advanced Functional Materials 29 (40), 1903360, 2019 | 45 | 2019 |
Three-dimensional silicon electronic systems fabricated by compressive buckling process BH Kim, J Lee, SM Won, Z Xie, JK Chang, Y Yu, YK Cho, H Jang, ... ACS nano 12 (5), 4164-4171, 2018 | 45 | 2018 |