| Design Guideline of 2.5 D Package with Emphasis on Warpage Control and Thermal Management J Hong, K Choi, D Oh, SB Park, S Shao, H Wang, Y Niu, VL Pham 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 682-692, 2018 | 39 | 2018 |
| A comprehensive study of electromigration in lead-free solder joint J Xu, C Cai, V Pham, K Pan, H Wang, S Park 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 284-289, 2020 | 28 | 2020 |
| The effect of solder paste volume on solder joint shape and self-alignment of passive components K Pan, JH Ha, VL Pham, H Wang, J Xu, SB Park 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1289-1297, 2020 | 25 | 2020 |
| Investigation of underfilling BGAs packages–Thermal fatigue VL Pham, J Xu, K Pan, J Wang, S Park, C Singh, H Wang 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2252-2258, 2020 | 23 | 2020 |
| Landing Stability Simulation of a 1/6 Lunar Module with Aluminum Honeycomb Dampers VL Pham, J Zhao, NS Goo, JH Lim, DS Hwang, JS Park International Journal of Aeronautical and Space Sciences 14 (4), 356-368, 2013 | 23 | 2013 |
| A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow J Wang, Y Niu, S Shao, H Wang, J Xu, V Pham, S Park Microelectronics Reliability 112, 113791, 2020 | 21 | 2020 |
| Product level design optimization for 2.5 D package pad cratering reliability during drop impact H Wang, J Wang, J Xu, V Pham, K Pan, S Park, H Lee, G Refai-Ahmed 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2343-2348, 2019 | 21 | 2019 |
| A study of substrate models and its effect on package warpage prediction VL Pham, H Wang, J Xu, J Wang, S Park, C Singh 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1130-1139, 2019 | 17 | 2019 |
| An assessment of electromigration in 2.5 D packaging J Xu, S McCann, H Wang, J Wang, VL Pham, SR Cain, G Refai-Ahmed, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2150-2155, 2019 | 14 | 2019 |
| Time 0 void evolution and effect on electromigration J Xu, S McCann, H Wang, VL Pham, SR Cain, G Refai-Ahmed, SB Park 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2331-2336, 2019 | 14 | 2019 |
| An accurate experimental determination of effective strain for heterogeneous electronic packages with digital image correlation method Y Niu, VL Pham, J Wang, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (4 …, 2018 | 13 | 2018 |
| Quantification of underfill influence to chip packaging interactions of WLCSP H Wang, S Shao, V Pham, P Shang, C Zhong, S Park International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018 | 12 | 2018 |
| Experimentally minimizing the gap distance between extra tall packages and PCB using the digital image correlation (DIC) method VL Pham, Y Niu, J Wang, H Wang, C Singh, S Park, C Zhong, SW Koh, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1593-1599, 2018 | 12 | 2018 |
| Effects of cyclic impacts on the performance of a piezo-composite electricity generating element in ad 33 mode energy harvesting VL Pham, NS Ha, NS Goo, JF Choo Journal of nanoscience and nanotechnology 14 (10), 7410-7418, 2014 | 9 | 2014 |
| Design of a d 33-mode piezocomposite electricity generating element and its application to bridge monitoring JF Choo, VL Pham, NS Goo Journal of Central South University 21 (7), 2572-2578, 2014 | 9 | 2014 |
| Shock performance enhancement of a container for rack server P Yin, H Wang, J Xu, V Pham, S Park 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 7 | 2020 |
