| A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs C Cai, J Xu, H Wang, SB Park Microelectronics Reliability 119, 114065, 2021 | 46 | 2021 |
| A comprehensive study of electromigration in lead-free solder joint J Xu, C Cai, V Pham, K Pan, H Wang, S Park 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 284-289, 2020 | 28 | 2020 |
| The effect of solder paste volume on solder joint shape and self-alignment of passive components K Pan, JH Ha, H Wang, J Xu, SB Park 2020 IEEE 70th Electronic components and Technology conference (EcTc), 1289-1297, 2020 | 25 | 2020 |
| Investigation of underfilling BGAs packages–Thermal fatigue VL Pham, J Xu, K Pan, J Wang, S Park, C Singh, H Wang 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2252-2258, 2020 | 23 | 2020 |
| The expermental and numerical study of electromigration in 2.5 D packaging J Xu, Y Niu, SR Cain, S McCann, HH Lee, G Refai-Ahmed, SB Park 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 483-489, 2018 | 23 | 2018 |
| An analysis of solder joint formation and self-alignment of chip capacitors K Pan, JH Ha, H Wang, J Xu, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020 | 22 | 2020 |
| A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow J Wang, Y Niu, S Shao, H Wang, J Xu, V Pham, S Park Microelectronics Reliability 112, 113791, 2020 | 21 | 2020 |
| Product level design optimization for 2.5 D package pad cratering reliability during drop impact H Wang, J Wang, J Xu, V Pham, K Pan, S Park, H Lee, G Refai-Ahmed 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2343-2348, 2019 | 21 | 2019 |
| Determination of smarter reflow profile to achieve a uniform temperature throughout a board Y Lai, K Pan, J Xu, J Yang, S Park 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 20 | 2021 |
| The effect of solder paste volume on chip resistor solder joint fatigue life H Wang, K Pan, J Ha, C Cai, J Xu, S Park Procedia Manufacturing 38, 1372-1380, 2019 | 20 | 2019 |
| Investigation of copper and glass interaction in through glass via (TGV) during thermal cycling K Pan, J Xu, Y Lai, S Park, C Okoro, D Joshi, S Pollard 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1660-1666, 2021 | 19 | 2021 |
| A comparison study of TIM degradation of phase change material and thermal grease J Yang, Y Lai, K Pan, J Xu, T Mikjaniec, S Cain, S Park 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1978-1983, 2021 | 18 | 2021 |
| A study of substrate models and its effect on package warpage prediction VL Pham, H Wang, J Xu, J Wang, S Park, C Singh 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1130-1139, 2019 | 17 | 2019 |
| An assessment of electromigration in 2.5 D packaging J Xu, S McCann, H Wang, J Wang, VL Pham, SR Cain, G Refai-Ahmed, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2150-2155, 2019 | 14 | 2019 |
| Time 0 void evolution and effect on electromigration J Xu, S McCann, H Wang, VL Pham, SR Cain, G Refai-Ahmed, SB Park 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2331-2336, 2019 | 14 | 2019 |
| In-situ temperature-dependent characterization of copper through glass via (TGV) K Pan, J Xu, Y Lai, S Park, C Okoro, D Joshi, S Pollard Microelectronics Reliability 129, 114487, 2022 | 12 | 2022 |
| Reliability of homogeneous Sn-Bi and hybrid Sn-Bi/SAC BGAs C Cai, J Xu, H Wang, S Park 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1496-1501, 2020 | 12 | 2020 |
| The optimal solution of reflow oven recipe based on physics-guided machine learning model Y Lai, K Pan, J Ha, C Cai, J Yang, P Yin, J Xu, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 10 | 2022 |
| A deep learning approach for reflow profile prediction Y Lai, J Kataoka, K Pan, J Ha, J Yang, KA Deo, J Xu, P Yin, C Cai, S Park 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2269-2274, 2022 | 10 | 2022 |
| Identification of polymer materials in electronic packages including counterfeit prevention J Yang, J Xu, S Park 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2317-2324, 2020 | 9 | 2020 |
