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Vivek SubramanianEcole polytechnique Federale de Lausanne (EPFL)Verified email at epfl.ch
Md Saifur RahmanDartmouth CollegeVerified email at dartmouth.edu
Gerd GrauAssociate Professor, York UniversityVerified email at eecs.yorku.ca
Youxiong YeBig River Steel; Dartmouth College; University of Tennessee, Knoxville; Central South UniversityVerified email at alum.utk.edu
Chuan LiuSun Yat-sen UniversityVerified email at mail.sysu.edu.cn
Yong XuNanjing University of Posts and TelecommunicationsVerified email at njupt.edu.cn
Andre ZeumaultDevice Engineer at AmorphyxVerified email at amorphyx.com
Nick RolstonAssistant Professor, Arizona State UniversityVerified email at asu.edu
Reinhold H. DauskardtRuth G. and William K. Bowes Professor, Stanford UniversityVerified email at stanford.edu
Oliver ZhaoStaff Engineer, Materials Characterization and Failure AnalysisVerified email at adeia.com
Austin FlickStanford UniversityVerified email at stanford.edu
Hongki KangAssociate Professor, Department of Biomedical Engineering, Seoul National UniversityVerified email at snu.ac.kr
Gerard GhibaudoIMEP-LAHC, Minatec-INP GrenobleVerified email at minatec.inpg.fr
Anand Prakash TiwariThayer School of Engineering, Dartmouth CollegeVerified email at dartmouth.edu
Seungjun ChungKorea UniversityVerified email at korea.ac.kr
Rajan KumarNorthwestern UniversityVerified email at northwestern.edu
Muhammed Ahosan Ul KarimElectrical Engineering and Computer Sciences, University of California, BerkeleyVerified email at eecs.berkeley.edu
Simon AgnewThayer School of Engineering, Dartmouth CollegeVerified email at dartmouth.edu
Justin P. ChenPh.D. Student, Stanford UniversityVerified email at stanford.edu
Jialiang CenUC BerkeleyVerified email at berkeley.edu