| A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs C Cai, J Xu, H Wang, SB Park Microelectronics Reliability 119, 114065, 2021 | 46 | 2021 |
| Design guideline of 2.5 D package with emphasis on warpage control and thermal management J Hong, K Choi, D Oh, SB Park, S Shao, H Wang, Y Niu 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 682-692, 2018 | 39 | 2018 |
| A comprehensive study of electromigration in lead-free solder joint J Xu, C Cai, V Pham, K Pan, H Wang, S Park 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 284-289, 2020 | 28 | 2020 |
| A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method Y Niu, J Wang, S Shao, H Wang, H Lee, SB Park Microelectronics reliability 87, 81-88, 2018 | 27 | 2018 |
| The effect of solder paste volume on solder joint shape and self-alignment of passive components K Pan, JH Ha, H Wang, J Xu, SB Park 2020 IEEE 70th Electronic components and Technology conference (EcTc), 1289-1297, 2020 | 25 | 2020 |
| Investigation of underfilling BGAs packages–Thermal fatigue VL Pham, J Xu, K Pan, J Wang, S Park, C Singh, H Wang 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2252-2258, 2020 | 23 | 2020 |
| In-situ warpage characterization of BGA packages with solder balls attached during reflow with 3D digital image correlation (DIC) Y Niu, H Wang, S Shao, SB Park 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 782-788, 2016 | 23 | 2016 |
| An analysis of solder joint formation and self-alignment of chip capacitors K Pan, JH Ha, H Wang, J Xu, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020 | 22 | 2020 |
| A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow J Wang, Y Niu, S Shao, H Wang, J Xu, V Pham, S Park Microelectronics Reliability 112, 113791, 2020 | 21 | 2020 |
| Product level design optimization for 2.5 D package pad cratering reliability during drop impact H Wang, J Wang, J Xu, V Pham, K Pan, S Park, H Lee, G Refai-Ahmed 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2343-2348, 2019 | 21 | 2019 |
| The effect of misaligned passive component on fatigue life of solder joints and solder shape J Ha, K Pan, H Wang, DH Won, SB Park 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 20 | 2020 |
| The effect of solder paste volume on chip resistor solder joint fatigue life H Wang, K Pan, J Ha, C Cai, J Xu, S Park Procedia Manufacturing 38, 1372-1380, 2019 | 20 | 2019 |
| A general strategy of in-situ warpage characterization for solder attached packages with digital image correlation method Y Niu, H Wang, SB Park Optics and Lasers in Engineering 93, 9-18, 2017 | 20 | 2017 |
| Lidless and lidded flip chip packages for advanced applications G Refai-Ahmed, H Wang, S Ramalingam, N Karunakaran, K Pan, SB Park, ... 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 104-111, 2020 | 18 | 2020 |
| A study of substrate models and its effect on package warpage prediction VL Pham, H Wang, J Xu, J Wang, S Park, C Singh 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1130-1139, 2019 | 17 | 2019 |
| The effect of solder paste volume on surface mount assembly self-alignment K Pan, JH Ha, HY Wang, V Veeraraghavan, SB Park Procedia Manufacturing 38, 1381-1393, 2019 | 16 | 2019 |
| An assessment of electromigration in 2.5 D packaging J Xu, S McCann, H Wang, J Wang, VL Pham, SR Cain, G Refai-Ahmed, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2150-2155, 2019 | 14 | 2019 |
| Time 0 void evolution and effect on electromigration J Xu, S McCann, H Wang, VL Pham, SR Cain, G Refai-Ahmed, SB Park 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2331-2336, 2019 | 14 | 2019 |
| Moisture diffusion and hygroscopic swelling of adhesives in electronics packaging R Liu, H Wang, J Wang, H Lee, SB Park, X Xue, Y Kim, S Saiyed, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2203-2209, 2016 | 14 | 2016 |
| Reliability of homogeneous Sn-Bi and hybrid Sn-Bi/SAC BGAs C Cai, J Xu, H Wang, S Park 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1496-1501, 2020 | 12 | 2020 |
Seungbae ParkProfessor of Mechanical Engineering, Binghamton UniversityVerified email at binghamton.edu
