| Study on Experiment and Mechanism of Bottom Blowing CO2 During the LF Refining Process Y Gu, H Wang, R Zhu, J Wang, M Lv, H Wang steel research international 85 (4), 589-598, 2014 | 42 | 2014 |
| Comprehensive study on 2.5 D package design for board-level reliability in thermal cycling and power cycling S Shao, Y Niu, J Wang, R Liu, S Park, H Lee, G Refai-Ahmed, L Yip 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1668-1675, 2018 | 36 | 2018 |
| A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method Y Niu, J Wang, S Shao, H Wang, H Lee, SB Park Microelectronics reliability 87, 81-88, 2018 | 27 | 2018 |
| Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions J Wang, R Liu, D Liu, S Park Microelectronics Reliability 73, 42-53, 2017 | 27 | 2017 |
| Non-linear finite element analysis on stacked die package subjected to integrated vapor-hygro-thermal-mechanical stress J Wang, S Park 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1394-1401, 2016 | 25 | 2016 |
| An examination on the direct concentration approach to simulating moisture diffusion in a multi-material system D Liu, J Wang, R Liu, SB Park Microelectronics Reliability 60, 109-115, 2016 | 24 | 2016 |
| Investigation of underfilling BGAs packages–Thermal fatigue VL Pham, J Xu, K Pan, J Wang, S Park, C Singh, H Wang 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2252-2258, 2020 | 23 | 2020 |
| Modeling and design of 2.5 D package with mitigated warpage and enhanced thermo-mechanical reliability J Wang, Y Niu, S Park, A Yatskov 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2477-2483, 2018 | 23 | 2018 |
| A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow J Wang, Y Niu, S Shao, H Wang, J Xu, V Pham, S Park Microelectronics Reliability 112, 113791, 2020 | 21 | 2020 |
| Product level design optimization for 2.5 D package pad cratering reliability during drop impact H Wang, J Wang, J Xu, V Pham, K Pan, S Park, H Lee, G Refai-Ahmed 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2343-2348, 2019 | 21 | 2019 |
| A study of substrate models and its effect on package warpage prediction VL Pham, H Wang, J Xu, J Wang, S Park, C Singh 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1130-1139, 2019 | 17 | 2019 |
| An assessment of electromigration in 2.5 D packaging J Xu, S McCann, H Wang, J Wang, VL Pham, SR Cain, G Refai-Ahmed, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2150-2155, 2019 | 14 | 2019 |
| An investigation of moisture-induced interfacial delamination in plastic IC package during solder reflow J Wang, Y Niu, S Park International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017 | 14 | 2017 |
| Moisture diffusion and hygroscopic swelling of adhesives in electronics packaging R Liu, H Wang, J Wang, H Lee, SB Park, X Xue, Y Kim, S Saiyed, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2203-2209, 2016 | 14 | 2016 |
| An accurate experimental determination of effective strain for heterogeneous electronic packages with digital image correlation method Y Niu, VL Pham, J Wang, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (4 …, 2018 | 13 | 2018 |
| The complete packaging reliability studies through one digital image correlation system Y Niu, J Wang, SB Park 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1916-1921, 2017 | 13 | 2017 |
| Experimentally minimizing the gap distance between extra tall packages and PCB using the digital image correlation (DIC) method VL Pham, Y Niu, J Wang, H Wang, C Singh, S Park, C Zhong, SW Koh, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1593-1599, 2018 | 12 | 2018 |
| Design guideline on board-level thermomechanical reliability of 2.5 D package S Shao, Y Niu, J Wang, R Liu, S Park, H Lee, L Yip, G Refai-Ahmed Microelectronics Reliability 111, 113701, 2020 | 9 | 2020 |
| Reasonable temperature schedules for cold or hot charging of continuously cast steel slabs Y Li, X Chen, K Liu, J Wang, J Wen, J Zhang Metallurgical and Materials Transactions A 44, 5354-5364, 2013 | 9 | 2013 |
| Optimal thermo-mechanical reliability design of 2.5 D lidless package J Yang, C Cai, P Yin, K Pan, Y Lai, J Wang, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 7 | 2022 |
Seungbae ParkProfessor of Mechanical Engineering, Binghamton UniversityVerified email at binghamton.edu
