| A comprehensive study of electromigration in lead-free solder joint J Xu, C Cai, V Pham, K Pan, H Wang, S Park 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 284-289, 2020 | 28 | 2020 |
| The effect of solder paste volume on solder joint shape and self-alignment of passive components K Pan, JH Ha, H Wang, J Xu, SB Park 2020 IEEE 70th Electronic components and Technology conference (EcTc), 1289-1297, 2020 | 25 | 2020 |
| An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model Y Lai, K Pan, Y Cen, J Yang, C Cai, P Yin, S Park Soldering & Surface Mount Technology 34 (5), 266-276, 2022 | 24 | 2022 |
| Investigation of underfilling BGAs packages–Thermal fatigue VL Pham, J Xu, K Pan, J Wang, S Park, C Singh, H Wang 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2252-2258, 2020 | 23 | 2020 |
| An analysis of solder joint formation and self-alignment of chip capacitors K Pan, JH Ha, H Wang, J Xu, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020 | 22 | 2020 |
| Product level design optimization for 2.5 D package pad cratering reliability during drop impact H Wang, J Wang, J Xu, V Pham, K Pan, S Park, H Lee, G Refai-Ahmed 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2343-2348, 2019 | 21 | 2019 |
| Determination of smarter reflow profile to achieve a uniform temperature throughout a board Y Lai, K Pan, J Xu, J Yang, S Park 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 20 | 2021 |
| The effect of misaligned passive component on fatigue life of solder joints and solder shape J Ha, K Pan, H Wang, DH Won, SB Park 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 20 | 2020 |
| The effect of solder paste volume on chip resistor solder joint fatigue life H Wang, K Pan, J Ha, C Cai, J Xu, S Park Procedia Manufacturing 38, 1372-1380, 2019 | 20 | 2019 |
| Investigation of copper and glass interaction in through glass via (TGV) during thermal cycling K Pan, J Xu, Y Lai, S Park, C Okoro, D Joshi, S Pollard 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1660-1666, 2021 | 19 | 2021 |
| Comparative analysis of package warpage using confocal method and digital image correlation C Cai, K Pan, J Yang, S Park 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 19 | 2020 |
| A comparison study of TIM degradation of phase change material and thermal grease J Yang, Y Lai, K Pan, J Xu, T Mikjaniec, S Cain, S Park 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1978-1983, 2021 | 18 | 2021 |
| Lidless and lidded flip chip packages for advanced applications G Refai-Ahmed, H Wang, S Ramalingam, N Karunakaran, K Pan, SB Park, ... 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 104-111, 2020 | 18 | 2020 |
| Smarter temperature setup for reflow oven to minimize temperature variation among components Y Lai, K Pan, C Cai, P Yin, J Yang, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 16 | 2022 |
| The effect of solder paste volume on surface mount assembly self-alignment K Pan, JH Ha, HY Wang, V Veeraraghavan, SB Park Procedia Manufacturing 38, 1381-1393, 2019 | 16 | 2019 |
| In-situ temperature-dependent characterization of copper through glass via (TGV) K Pan, J Xu, Y Lai, S Park, C Okoro, D Joshi, S Pollard Microelectronics Reliability 129, 114487, 2022 | 12 | 2022 |
| Shape dependency of fatigue life in solder joints of chip resistors J Ha, C Cai, P Yin, Y Lai, K Pan, J Yang, S Park 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1489-1494, 2022 | 11 | 2022 |
| The optimal solution of reflow oven recipe based on physics-guided machine learning model Y Lai, K Pan, J Ha, C Cai, J Yang, P Yin, J Xu, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 10 | 2022 |
| A deep learning approach for reflow profile prediction Y Lai, J Kataoka, K Pan, J Ha, J Yang, KA Deo, J Xu, P Yin, C Cai, S Park 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2269-2274, 2022 | 10 | 2022 |
| Thermomechanical reliability of BGA packages with different underfill reinforcement methods Y Lai, C Cai, K Pan, J Yang, J Ha, P Yin, K Deo, S Park International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 7 | 2022 |
Seungbae ParkProfessor of Mechanical Engineering, Binghamton UniversityVerified email at binghamton.edu
