| Effect of Time-Delay Controller on an Electrically Actuated Resonator with Velocity Feedback S Shao, KM Masri, MI Younis Nonlinear Dynamics 74 (1), 257-270, 2013 | 50* | 2013 |
| Design guideline of 2.5 D package with emphasis on warpage control and thermal management J Hong, K Choi, D Oh, SB Park, S Shao, H Wang, Y Niu 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 682-692, 2018 | 39 | 2018 |
| Comprehensive study on 2.5 D package design for board-level reliability in thermal cycling and power cycling S Shao, Y Niu, J Wang, R Liu, S Park, H Lee, G Refai-Ahmed, L Yip 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1668-1675, 2018 | 36 | 2018 |
| A study of direct liquid cooling for high-density chips and accelerators T Gao, S Shao, Y Cui, B Espiritu, C Ingalz, H Tang, A Heydari 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 30 | 2017 |
| A Novel Speckle-Free Digital Image Correlation Method for In Situ Warpage Characterization Y Niu, S Shao, SB Park, CL Kao IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (2 …, 2017 | 29 | 2017 |
| A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method Y Niu, J Wang, S Shao, H Wang, H Lee, SB Park Microelectronics reliability 87, 81-88, 2018 | 27 | 2018 |
| In-situ warpage characterization of BGA packages with solder balls attached during reflow with 3D digital image correlation (DIC) Y Niu, H Wang, S Shao, SB Park 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 782-788, 2016 | 23 | 2016 |
| A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow J Wang, Y Niu, S Shao, H Wang, J Xu, V Pham, S Park Microelectronics Reliability 112, 113791, 2020 | 21 | 2020 |
| Modular quick-release liquid heat removal coupling system for electronic racks T Gao, Y Cui, S Shuai, CJ Ingalz, A Heydari US Patent 10,609,840, 2020 | 12 | 2020 |
| Quantification of underfill influence to chip packaging interactions of WLCSP H Wang, S Shao, V Pham, P Shang, C Zhong, S Park International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018 | 12 | 2018 |
| Experimentally minimizing the gap distance between extra tall packages and PCB using the digital image correlation (DIC) method VL Pham, Y Niu, J Wang, H Wang, C Singh, S Park, C Zhong, SW Koh, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1593-1599, 2018 | 12 | 2018 |
| A study on the thermomechanical reliability risks of through-silicon-vias in sensor applications S Shao, D Liu, Y Niu, K O’Donnell, D Sengupta, S Park Sensors 17 (2), 322, 2017 | 12 | 2017 |
| Die stress in stealth dicing for MEMS S Shao, D Liu, Y Niu, S Park Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 …, 2016 | 12 | 2016 |
| Design guideline on board-level thermomechanical reliability of 2.5 D package S Shao, Y Niu, J Wang, R Liu, S Park, H Lee, L Yip, G Refai-Ahmed Microelectronics Reliability 111, 113701, 2020 | 9 | 2020 |
| Lithium-ion battery life cycle prediction with deep learning regression model H Yang, Y Cao, H Xie, S Shao, J Zhao, T Gao, J Zhang, B Zhang 2020 IEEE Applied Power Electronics Conference and Exposition (APEC), 3346-3351, 2020 | 9 | 2020 |
| Delayed feedback controller for microelectromechanical systems resonators undergoing large motion KM Masri, S Shao, MI Younis Journal of Vibration and Control 21 (13), 2015 | 9 | 2015 |
| Liquid distribution for electronic racks S Shuai, T Gao US Patent 11,252,844, 2022 | 7 | 2022 |
| Connector interface for liquid-cooled IT servers S Shuai, T Gao US Patent 11,129,292, 2021 | 7 | 2021 |
| Optimal control logic for cooling power in battery thermal management S Shuai, H Yang, T Gao US Patent 11,271,263, 2022 | 4 | 2022 |
| Battery backup unit (BBU) shelf with a fire extinguishing system S Shuai, T Gao, H Yang US Patent 11,211,669, 2021 | 4 | 2021 |
Seungbae ParkProfessor of Mechanical Engineering, Binghamton UniversityVerified email at binghamton.edu
